hdi board
High Density Interconnect (HDI) boards represent a cutting-edge advancement in printed circuit board technology, offering unprecedented levels of circuit density and miniaturization. These sophisticated boards feature blind vias, buried vias, and microvias with diameters typically less than 150 micrometers, enabling complex interconnections between multiple layers. HDI boards utilize advanced manufacturing processes to achieve finer lines and spaces, smaller vias, and higher connection pad densities than traditional PCBs. The technology employs sequential lamination processes and laser drilling techniques to create intricate interconnection patterns, allowing for more components to be placed in a smaller area. HDI boards are particularly valuable in modern electronics, where they facilitate the development of smaller, lighter, and more powerful devices. They support higher component density, improved electrical performance, and enhanced signal integrity, making them essential for applications ranging from smartphones and tablets to advanced medical devices and aerospace systems.
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